View VND1NV04-1_8355774.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

september 2013 doc id 7381 rev 4 1/33 1 vnd1nv04 vnn1nv04 - vns1nv04 omnifet ii fully autoprotected power mosfet features linear current limitation thermal shutdown short circuit protection integrated clamp low current drawn from input pin diagnostic feedback through input pin esd protection direct access to the gate of the power mosfet (analog driving) compatible with standard power mosfet description the vnd1nv04, vnn1nv04, vns1nv04 are monolithic devices designed in stmicroelectronics ? vipower ? m0-3 technology, intended for replacement of standard power mosfets from dc up to 50 khz applications. built in thermal shutdown, linear current limitation and overvoltage clamp protect the chip in harsh environments. fault feedback can be detected by monitoring the voltage at the input pin. parameter symbol value max on-state resistance (per ch.) r on 250 m current limitation (typ) i limh 1.7 a drain-source clamp voltage v clamp 40 v 1 3 to-252 (dpak) sot-223 so-8 1 2 2 3 table 1. device summary package order codes tube tube (lead free) tape and reel tape and reel (lead free) to-252 (dpak) vnd1nv04 vnd1nv04-e vnd1nv0413tr vnd1nv04tr-e sot-223 vnn1nv04 - vnn1nv0413tr - so-8 vns1nv04 - vns1nv0413tr - www.st.com
contents vnd1nv04 - vnn1nv04 - vns1nv04 2/33 doc id 7381 rev 4 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3 protection features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4 package and pcb thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.1 dpak thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.2 sot-223 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.3 so-8 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5 package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.1 dpak mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.2 sot-223 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.3 so8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.4 dpak packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.5 sot-223 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.6 so8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
vnd1nv04 - vnn1nv04 - vns1nv04 list of tables doc id 7381 rev 4 3/33 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 3. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 4. electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 5. dpak thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 6. sot-223 thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 table 7. so-8 thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 8. dpak mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 table 9. so-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 10. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
list of figures vnd1nv04 - vnn1nv04 - vns1nv04 4/33 doc id 7381 rev 4 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 3. current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 4. switching time test circuit for resistive load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 5. test circuit for diode recovery times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 6. unclamped inductive load test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 7. input charge test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 8. unclamped inductive waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 9. source-drain diode forward characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 10. static drain-source on resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 11. derating curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 12. static drain-source on resistance vs. input voltage (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . 12 figure 13. static drain-source on resistance vs. input voltage (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . 12 figure 14. transconductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 15. static drain-source on resistance vs. id . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 16. transfer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 17. turn-on current slope (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 18. turn-on current slope (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 19. input voltage vs. input charge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 20. turn-off drain source voltage slope (part 1/2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 21. turn-off drain-source voltage slope (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 22. capacitance variations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 23. switching time resistive load (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 24. switching time resistive load (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 25. output characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 26. normalized on resistance vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 27. normalized input threshold voltage vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 28. normalized current limit vs. junction temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 29. step response current limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 30. dpak pc board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 31. dpak rthj-amb vs. pcb copper area in open box free air condition . . . . . . . . . . . . . . . . . 17 figure 32. dpak thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 33. dpak thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 34. sot-223 pc board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 35. sot-223 rthj-amb vs. pcb copper area in open box free air condition . . . . . . . . . . . . . . 20 figure 36. sot-223 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . 20 figure 37. sot-223 thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 38. so-8 pc board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 figure 39. so-8 rthj-amb vs. pcb copper area in open box free air condition . . . . . . . . . . . . . . . . . 22 figure 40. so-8 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 23 figure 41. so-8 thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 figure 42. dpak package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 figure 43. sot-223 mechanical data & package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 figure 44. so-8 package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 figure 45. sot-223 tape and reel shipment (suffix ?tr?) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 figure 46. so-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 figure 47. so-8 tape and reel shipment (suffix ?tr?) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1
vnd1nv04 - vnn1nv04 - vns1nv04 block diagram and pin description doc id 7381 rev 4 5/33 1 block diagram and pin description figure 1. block diagram figure 2. configuration diagram (top view) 1. for the pins configuration related to sot-223 and dpak see outline at page 1. overvoltage gate linear drain source clamp 1 2 3 current limiter control over temperature input drain drain drain drain input source source source 1 4 5 8
electrical specifications vnd1nv04 - vnn1nv04 - vns1nv04 6/33 doc id 7381 rev 4 2 electrical specifications figure 3. current and voltage conventions 2.1 absolute maximum ratings the rating listed in table 2: absolute maximum ratings may cause permanent damage to the device. these are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. drain input source i d i in v in v ds r in table 2. absolute maximum ratings symbol parameter value unit sot-223 so-8 dpak v dsn drain-source voltage (v inn =0 v) internally clamped v v inn input voltage internally clamped v i inn input current +/-20 ma r in minn minimum input series impedance 330 i dn drain current internally limited a i rn reverse dc output current -3 a v esd1 electrostatic discharge (r=1.5 k , c=100 pf) 4000 v v esd2 electrostatic discharge on output pins only (r=330 , c=150 pf) 16500 v p tot total dissipation at t c =25 c 7 8.3 35 w t j operating junction temperature internally limited c t c case operating temperature internally limited c t stg storage temperature -55 to 150 c
vnd1nv04 - vnn1nv04 - vns1nv04 electrical specifications doc id 7381 rev 4 7/33 2.2 thermal data 2.3 electrical characteristics table 3. thermal data symbol parameter maximum value unit sot-223 so-8 dpak r thj-case thermal resistance junction-case 18 3.5 c/w r thj-lead thermal resistance junction-lead 15 c/w r thj-amb thermal resistance junction-ambient 70 (1) 1. when mounted on a standard single-sided fr4 board with 50 mm 2 of cu (at least 35 m thick) connected to all drain pins 65 (1) 54 (1) c/w table 4. electrical characteristics symbol parameter test conditions min. typ. max. unit off (-40 c electrical specifications vnd1nv04 - vnn1nv04 - vns1nv04 8/33 doc id 7381 rev 4 switching (t j =25 c, unless otherwise specified) t d(on) turn-on delay time v dd =15 v; i d =0.5 a v gen =5 v; r gen =r in min =330 (see figure 4 ) 70 200 ns t r rise time 170 500 ns t d(off) turn-off delay time 350 1000 ns t f fall time 200 600 ns t d(on) turn-on delay time v dd =15 v; i d =0.5 a v gen =5 v; r gen =2.2 k (see figure 4 ) 0.25 1.0 s t r rise time 1.3 4.0 s t d(off) turn-off delay time 1.8 5.5 s t f fall time 1.2 4.0 s (di/dt) on turn-on current slope v dd =15 v; i d =1.5 a v gen =5 v; r gen =r in min =330 5a/s q i total input charge v dd =12 v; i d =0.5 a; v in =5 v i gen =2.13 ma (see figure 7 ) 5nc source drain diode (t j =25 c, unless otherwise specified) v sd (1) forward on voltage i sd =0.5 a; v in =0 v 0.8 v t rr reverse recovery time i sd =0.5 a; di/dt=6 a/s v dd =30v; l=200h (see figure 5 ) 205 ns q rr reverse recovery charge 100 nc i rrm reverse recovery current 0.7 a protections (-40 c vnd1nv04 - vnn1nv04 - vns1nv04 electrical specifications doc id 7381 rev 4 9/33 figure 4. switching time test circuit for resistive load t i d 90% 10% t v gen t d(on) t d(off) t f t r r gen v gen v d
electrical specifications vnd1nv04 - vnn1nv04 - vns1nv04 10/33 doc id 7381 rev 4 figure 5. test circuit for diode recovery times figure 6. unclamped inductive load test circuits l=100uh a b 8.5 v dd r gen fast diode omnifet a d i s 330 b omnifet d s i v gen r gen p w v in
vnd1nv04 - vnn1nv04 - vns1nv04 electrical specifications doc id 7381 rev 4 11/33 figure 7. input charge test circuit figure 8. unclamped inductive waveforms gen nd8003 v in
electrical specifications vnd1nv04 - vnn1nv04 - vns1nv04 12/33 doc id 7381 rev 4 2.4 electrical characteristics curves figure 9. source-drain diode forward characteristics figure 10. static drain-source on resistance figure 11. derating curve figure 12. static drain-source on resistance vs. input voltage (part 1/2) figure 13. static drain-source on resistance vs. input voltage (part 2/2) figure 14. transconductance 02468101214 id (a) 700 750 800 850 900 950 1000 vsd (mv) vin=0v 0 0.05 0.1 0.15 0.2 0.25 0.3 id(a) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 rds(on) (ohms) tj=25oc tj=150oc tj=-40oc vin=2.5v 33.544.555.566.57 vin(v) 0 50 100 150 200 250 300 350 400 450 500 rds(on) (mohms) id=0.5a tj=150oc tj=-40oc tj=25oc 3 3.5 4 4.5 5 5.5 6 6.5 vin(v) 0 50 100 150 200 250 300 350 400 450 500 rds(on) (mohms) id=1.5a id=1a id=1.5a id=1a id=1.5a id=1a tj=25oc tj=150oc tj=-40oc 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 id(a) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 gfs (s) vds=13v tj=25oc tj=150oc tj=-40oc
vnd1nv04 - vnn1nv04 - vns1nv04 electrical specifications doc id 7381 rev 4 13/33 figure 15. static drain-source on resistance vs. id figure 16. transfer characteristics figure 17. turn-on current slope (part 1/2) figure 18. turn-on current slope (part 2/2) figure 19. input voltage vs. input charge figure 20. turn-off drain source voltage slope (part 1/2) 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 id(a) 0 50 100 150 200 250 300 350 400 450 500 rds(on) (mohms) tj=25oc tj=150oc tj=-40oc vin=5v vin=3.5v vin=5v vin=5v vin=3.5v vin=3.5v 1.5 1.75 2 2.25 2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 vin(v) 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 idon(a) vds=13.5v tj=150oc tj=25oc tj=-40oc 0 500 1000 1500 2000 2500 rg(ohm) 0 1 2 3 4 5 6 di/dt(a/us) vin=5v vdd=15v id=1.5a 0 500 1000 1500 2000 2500 rg(ohm) 0.2 0.4 0.6 0.8 1 1.2 1.4 di/dt(a/us) vin=3.5v vdd=15v id=1.5a 0 123456 qg (nc) 0 1 2 3 4 5 6 vin (v) vds=12v id=0.5a 0 500 1000 1500 2000 2500 rg(ohm) 0 50 100 150 200 250 300 350 dv/dt(v/us) vin=5v vdd=15v id=0.5a
electrical specifications vnd1nv04 - vnn1nv04 - vns1nv04 14/33 doc id 7381 rev 4 figure 21. turn-off drain-source voltage slope (part 2/2) figure 22. capacitance variations figure 23. switching time resistive load (part 1/2) figure 24. switching time resistive load (part 2/2) figure 25. output characteristics figure 26. normalized on resistance vs. temperature 0 500 1000 1500 2000 2500 rg(ohm) 0 50 100 150 200 250 300 350 dv/dt(v/us) vin=3.5v vdd=15v id=0.5a 0 5 10 15 20 25 30 35 vds(v) 50 75 100 125 150 175 200 225 c(pf) f=1mhz vin=0v 0 250 500 750 1000 1250 1500 1750 2000 2250 2500 rg(ohm) 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 t(us) vdd=15v id=0.5a vin=5v td(off) td(on) tf tr 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 vin(v) 0 50 100 150 200 250 300 350 400 450 500 550 t(ns) vdd=15v id=0.5a rg=330ohm tr td(off) tf td(on) 0123456789101112 vds(v) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 id(a) vin=3v vin=5.5v vin=3.5v vin=4.5v -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0.5 0.75 1 1.25 1.5 1.75 2 2.25 rds(on) (mohm) vin=5v id=0.5a
vnd1nv04 - vnn1nv04 - vns1nv04 electrical specifications doc id 7381 rev 4 15/33 figure 27. normalized input threshold voltage vs. temperature figure 28. normalized current limit vs. junction temperature figure 29. step response current limit -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 vinth (v) vds=vin id=1ma -50 -25 0 25 50 75 100 125 150 175 tc ( o c ) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 ilim (a) vin=5v vds=13v 5 101520253035 vdd(v) 1.9 2 2.1 2.2 2.3 2.4 tdlim(us) vin=5v rg=330ohm
protection features vnd1nv04 - vnn1nv04 - vns1nv04 16/33 doc id 7381 rev 4 3 protection features during normal operation, the input pin is electrically connected to the gate of the internal power mosfet through a low impedance path. the device behaves like a standard power mosfet and it can be used as a switch from dc up to 50 khz. the only difference from the user?s point of view is that a small dc current i iss (typ. 100 a) flows into the input pin in order to supply the internal circuitry. the device integrates: overvoltage clamp protection gives ? internally set at 45 v, along with the rugged avalanche characteristics of the power mosfet stage give this device unrivalled ruggedness and energy handling capability. this feature is mainly important when driving inductive loads. linear current limiter circuit ? limits the drain current i d to i lim whatever the input pin voltages. when the current limiter is active, the device operates in the linear region, so power dissipation may exceed the capability of the heatsink. both case and junction temperatures increase, and if this phase lasts long enough, junction temperature may reach the overtemperature threshold t jsh. overtemperature and short circuit protection ? these are based on sensing the chip temperature and are not dependent on the input voltage. the location of the sensing element on the chip in the power stage area ensures fast, accurate detection of the junction temperature. overtemperature cutout ranges is from 150 to 190 c, a typical value is 170 c. the device is automatically restarted when the chip temperature falls of about 15 c below shutdown temperature. status feedback ? in the case of an overtemperature fault condition (t j > t jsh ), the device tries to sink a diagnostic current i gf through the input pin in order to indicate fault condition. if driven from a low impedance source, this current may be used in order to warn the control circuit of a device shutdown. if the drive impedance is high enough so that the input pin driver is not able to supply the current i gf , the input pin falls to 0 v. this does not however affect the device operation: no requirement is put on the current capability of the input pin driver except to be able to supply the normal operation drive current i iss . additional features of this device are esd protection according to the human body model and the ability to be driven from a ttl logic circuit.
vnd1nv04 - vnn1nv04 - vns1nv04 package and pcb thermal data doc id 7381 rev 4 17/33 4 package and pcb thermal data 4.1 dpak thermal data figure 30. dpak pc board 1. layout condition of r th and z th measurements (pcb fr4 area = 58 mm x 58 mm,pcb thickness = 2 mm, cu thickness=35 m , copper areas: from minimum pad layout to 16 cm 2 ). figure 31. dpak r thj-amb vs. pcb copper area in open box free air condition 30 40 50 60 70 80 90 0246810 pcb cu heatsink area (cm^ 2) - (refer to pcb layout) footprint
package and pcb thermal data vnd1nv04 - vnn1nv04 - vns1nv04 18/33 doc id 7381 rev 4 figure 32. dpak thermal impedance junction ambient single pulse equation 1: pulse calculation formula where = t p /t figure 33. dpak thermal fitting model of a single channel 0,1 1 10 100 0,0001 0,001 0,01 0,1 1 10 100 1000 time ( s) zth (c/ w) footprint 6 cm 2 z th r th z thtp 1 ? () + ? =
vnd1nv04 - vnn1nv04 - vns1nv04 package and pcb thermal data doc id 7381 rev 4 19/33 table 5. dpak thermal parameter 4.2 sot-223 thermal data figure 34. sot-223 pc board 1. layout condition of r th and z th measurements (pcb fr4 area = 58 mm x 58 mm,pcb thickness = 2 mm, cu thickness=35 m , copper areas: from minimum pad layout to 0.8 cm 2 ). area/island (cm 2 )0.256 r1 (c/w) 0.8 r2 (c/w) 1.6 r3 (c/w) 0.8 r4 (c/w) 2 r5 (c/w) 15 r6 (c/w) 61 24 c1 (ws/c) 0.00006 c2 (ws/c) 0.0005 c3 (ws/c) 0.01 c4 (ws/c) 0.3 c5 (ws/c) 0.45 c6 (ws/c) 0.8 5 .
package and pcb thermal data vnd1nv04 - vnn1nv04 - vns1nv04 20/33 doc id 7381 rev 4 figure 35. sot-223 r thj-amb vs. pcb copper area in open box free air condition figure 36. sot-223 thermal impedance junction ambient single pulse 60 70 80 90 100 110 120 130 140 0 0,5 1 1,5 2 2,5 pcb cu heatsink area (cm^ 2) - (refer to pcb layout) footprint 0,1 1 10 100 1000 0,0001 0,001 0,01 0,1 1 10 100 1000 time ( s) zth (c/ w) footprint 2 cm 2
vnd1nv04 - vnn1nv04 - vns1nv04 package and pcb thermal data doc id 7381 rev 4 21/33 equation 2: pulse calculation formula where = t p /t figure 37. sot-223 thermal fitting model of a single channel table 6. sot-223 thermal parameter area/island (cm 2 )fp2 r1 (c/w) 0.8 r2 (c/w) 1.6 r3 (c/w) 4.5 r4 (c/w) 24 r5 (c/w) 0.1 r6 (c/w) 100 45 c1 (ws/c) 0.00006 c2 (ws/c) 0.0005 c3 (ws/c) 0.03 c4 (ws/c) 0.16 c5 (ws/c) 1000 c6 (ws/c) 0.5 2 z th r th z thtp 1 ? () + ? =
package and pcb thermal data vnd1nv04 - vnn1nv04 - vns1nv04 22/33 doc id 7381 rev 4 4.3 so-8 thermal data figure 38. so-8 pc board 1. layout condition of r th and z th measurements (pcb fr4 area = 58 mm x 58 mm,pcb thickness = 2 mm, cu thickness=35 m , copper areas: from minimum pad layout to 2 cm 2 ). figure 39. so-8 r thj-amb vs. pcb copper area in open box free air condition . 65 75 85 95 105 00,511,522,5 pcb cu heatsink area (cm^ 2) - (refer to pcb layout) footprint
vnd1nv04 - vnn1nv04 - vns1nv04 package and pcb thermal data doc id 7381 rev 4 23/33 figure 40. so-8 thermal impedance junction ambient single pulse equation 3: pulse calculation formula where = t p /t figure 41. so-8 thermal fitting model of a single channel zth (c/ w) 0,1 1 10 100 1000 0,0001 0,001 0,01 0,1 1 10 100 1000 time (s) footprint 2 cm 2 z th r th z thtp 1 ? () + ? =
package and pcb thermal data vnd1nv04 - vnn1nv04 - vns1nv04 24/33 doc id 7381 rev 4 table 7. so-8 thermal parameter area/island (cm 2 )fp2 r1 (c/w) 0.8 r2 (c/w) 2.6 r3 (c/w) 3.5 r4 (c/w) 21 r5 (c/w) 16 r6 (c/w) 58 28 c1 (ws/c) 0.00006 c2 (ws/c) 0.0005 c3 (ws/c) 0.0075 c4 (ws/c) 0.045 c5 (ws/c) 0.35 c6 (ws/c) 1.05 2
vnd1nv04 - vnn1nv04 - vns1nv04 package and packing information doc id 7381 rev 4 25/33 5 package and packing information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 5.1 dpak mechanical data figure 42. dpak package dimensions p032p
package and packing information vnd1nv04 - vnn1nv04 - vns1nv04 26/33 doc id 7381 rev 4 table 8. dpak mechanical data dim. mm. min. typ. max. a2.20 2.40 a1 0.90 1.10 a2 0.03 0.23 b0.64 0.90 b2 5.20 5.40 c0.45 0.60 c2 0.48 0.60 d6.00 6.20 d1 5.1 e6.40 6.60 e1 4.7 e2.28 g4.40 4.60 h9.35 10.10 l2 0.8 l4 0.60 1.00 r0.2 v2 0 8 package weight gr. 0.29
vnd1nv04 - vnn1nv04 - vns1nv04 package and packing information doc id 7381 rev 4 27/33 5.2 sot-223 mechanical data figure 43. sot-223 mechanical data & package outline 5.3 so8 mechanical data table 9. so-8 mechanical data dim. mm min. typ. max. a 1.75 a1 0.10 0.25 a2 1.25
package and packing information vnd1nv04 - vnn1nv04 - vns1nv04 28/33 doc id 7381 rev 4 figure 44. so-8 package dimension b 0.28 0.48 c 0.17 0.23 d (1) 4.80 4.90 5.00 e 5.80 6.00 6.20 e1 (2) 3.80 3.90 4.00 e 1.27 h 0.25 0.50 l 0.40 1.27 l1 1.04 k 0 8 ccc 0.10 1. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 mm in total (both side). 2. dimension ?e1? does not include interlead flash or pr otrusions. interlead flash or protrusions shall not exceed 0.25 mm per side. table 9. so-8 mechanical data (continued) dim. mm min. typ. max. 0016023 d
vnd1nv04 - vnn1nv04 - vns1nv04 package and packing information doc id 7381 rev 4 29/33 5.4 dpak packing information the devices can be packed in tube or tape and reel shipments (see the table 1: device summary ). dpak footprint tube shipment (no suffix) a c b all dimensions are in mm. base q.ty 75 bulk q.ty 3000 tube length ( 0.5) 532 a 6 b 21.3 c ( 0.1) 0.6 tape and reel shipment (suffix ?13tr?) reel dimensions base q.ty 2500 bulk q.ty 2500 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 16.4 n (min) 60 t (max) 22.4 tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb 1986 all dimensions are in mm. tape width w 16 tape hole spacing p0 ( 0.1) 4 component spacing p 8 hole diameter d ( 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 7.5 compartment depth k (max) 6.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed
package and packing information vnd1nv04 - vnn1nv04 - vns1nv04 30/33 doc id 7381 rev 4 5.5 sot-223 packing information figure 45. sot-223 tape and reel shipment (suffix ?tr?) reel dimensions base q.ty 1000 bulk q.ty 1000 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 12.4 n (min) 60 t (max) 18.4 tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb. 1986 all dimensions are in mm. tape width w 12 tape hole spacing p0 ( 0.1) 4 component spacing p 8 hole diameter d (+ 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 5.5 compartment depth k (max) 4.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed
vnd1nv04 - vnn1nv04 - vns1nv04 package and packing information doc id 7381 rev 4 31/33 5.6 so8 packing information figure 46. so-8 tube shipment (no suffix) figure 47. so-8 tape and reel shipment (suffix ?tr?) all dimensions are in mm. base q.ty 100 bulk q.ty 2000 tube length ( 0.5) 532 a 3.2 b 6 c ( 0.1) 0.6 c b a tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb. 1986 all dimensions are in mm. tape width w 12 tape hole spacing p0 ( 0.1) 4 component spacing p 8 hole diameter d (+ 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 5.5 compartment depth k (max) 4.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed reel dimensions all dimensions are in mm. base q.ty 2500 bulk q.ty 2500 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 12.4 n (min) 60 t (max) 18.4
revision history vnd1nv04 - vnn1nv04 - vns1nv04 32/33 doc id 7381 rev 4 6 revision history table 10. document revision history date revision changes feb-2003 1 initial release. 16-apr-2009 2 added table 1: device summary and section 4: package and pcb thermal data updated section 5: package and packing information on page 25 01-dic-2011 3 upadate table 1: device summary . update the entire document using the new coorporate template. 20-sep-2013 4 updated disclaimer.
vnd1nv04 - vnn1nv04 - vns1nv04 doc id 7381 rev 4 33/33 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com

▲Up To Search▲

Price & Availability of VND1NV04-1

	To Download VND1NV04-1 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .